Under the themes "Ultimate Product Range" and "Total Fab Solutions," visitors explored the joint product portfolio of the Busch Group. The display included vacuum pumps, contamination management systems, leak detectors, valves, gas abatement solutions, and comprehensive sub-fab management. These products meet the evolving needs of the semiconductor industry in Taiwan. Neil Chen, General Manager of Pfeiffer Vacuum Taiwan, stated: "We provide comprehensive vacuum fab solutions, enabling our customers to reliably increase their yield. Additionally, we foster optimal cooperation on ESG matters."
Unmatched range of vacuum and abatement solutions
Among the highlights of the exhibition were several innovative products: Featuring an integrated turbomolecular vacuum pump, the ASM 392 from Pfeiffer Vacuum is SEMI S2 compliant and optimized for rapid vacuum pump downs as well as short response times on large test objects. Its dry, frictionless backing pump and a powerful high vacuum pump made it ideal for testing in clean room environments.
With its compact footprint, Pfeiffer Vacuum’s ATH 2804 M magnetically levitated turbomolecular vacuum pump provides high gas throughput, making it ideal for semiconductor manufacturing processes. The HiPace 3400 IT, designed exclusively for demanding ion implantation applications, sets the standard as the most compact turbopump in its class. The DN 320 flange size increases the pumping speed for process gases by up to an impressive 30%. Its unique bearing concept and specially coated rotor design protect both the process and the pump, providing unparalleled durability as well as reliability.
The COBRA NX 0950 A PLUS from Busch Vacuum Solutions is a reliable dry vacuum pump with proven screw vacuum technology for minimal maintenance, and energy-efficient operation. As a fully connected vacuum pump with remote control, condition monitoring and communication options, this pump is ready for Industry 4.0 and perfectly suited as the heart of a central vacuum system.
Showcased in a digital format, the high-temperature thermal abatement system from centrotherm clean solutions combines the wide process coverage of flame abatement with the fuel-free aspects of plasma abatement. It features lower operating costs as well as secondary emissions and is capable of destroying the molecular process gas NF3 at class-leading levels with extremely low NOx emissions. This system provides a sustainable solution with a minimal carbon footprint for the CVD and metal-etch process family.
Trade show visitors met experts from Busch Vacuum Solutions, Pfeiffer Vacuum, and centrotherm clean solutions at Semicon Taiwan. The event offered an excellent opportunity for attendees to engage with industry leaders and learn more about the latest advancements in vacuum and abatement technology.
The three companies of the Busch Group showcased the combined competence and technological expertise at Semicon Taiwan. Source: Busch Group